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ORCIDEmile Noothout
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- affiliation: Delft University of Technology, Netherlands
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2020 – today
- 2024
[j12]Yannick M. Hopf
, Djalma Simões dos Santos, Boudewine W. Ossenkoppele, Mehdi Soozande, Emile Noothout, Zu-Yao Chang, Chao Chen, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes. IEEE J. Solid State Circuits 59(2): 476-491 (2024)- [j11]Peng Guo, Fabian Fool, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A 125 μ m-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography. IEEE J. Solid State Circuits 59(8): 2604-2617 (2024) - [c12]Nuriel N. M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick Hopf, Jason D. Voorneveld, Djalma Simões dos Santos, Emile Noothout, Zu-Yao Chang, Chao Chen, Vincent A. Henneken, Nico de Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A. P. Pertijs:
A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm2 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer. VLSI Technology and Circuits 2024: 1-2 - 2023
- [j10]Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. IEEE J. Solid State Circuits 58(6): 1693-1705 (2023) - [j9]Peng Guo, Fabian Fool, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging. IEEE J. Solid State Circuits 58(9): 2607-2618 (2023) - [c11]P. Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johannes G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink. VLSI Technology and Circuits 2023: 1-2 - 2022
- [j8]Yannick M. Hopf, Boudewine W. Ossenkoppele, Mehdi Soozande, Emile Noothout, Zu-Yao Chang, Chao Chen, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography. IEEE J. Solid State Circuits 57(11): 3228-3242 (2022) - [j7]Djalma Simões dos Santos, Fabian Fool, Moein Mozaffarzadeh, Maysam Shabanimotlagh, Emile Noothout, Taehoon Kim, Nuriel Rozsa, Hendrik J. Vos, Johan G. Bosch, Michiel A. P. Pertijs, Martin D. Verweij, Nico de Jong:
A Tiled Ultrasound Matrix Transducer for Volumetric Imaging of the Carotid Artery. Sensors 22(24): 9799 (2022) - [c10]Yannick Hopf, Boudewine W. Ossenkoppele, Mehdi Soozande, Emile Noothout, Zu-Yao Chang, Chao Chen, Hendrik J. Vos, Hans G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes. ISSCC 2022: 494-496 - [c9]Peng Guo, Fabian Fool, Emile Noothout, Zu-Yao Chang, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jonq, Michiel A. P. Pertijs:
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging. ISSCC 2022: 496-498 - 2021
- [j6]Douwe van Willigen, Eunchul Kang, Jovana Janjic, Emile Noothout, Zu-Yao Chang, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Transceiver ASIC for a Single-Cable 64-Element Intra-Vascular Ultrasound Probe. IEEE J. Solid State Circuits 56(10): 3157-3166 (2021) - [j5]Taehoon Kim, Fabian Fool, Djalma Simões dos Santos, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging. Sensors 21(1): 150 (2021) - [c8]Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johannes G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. ESSCIRC 2021: 163-166 - [c7]Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. ESSDERC 2021: 163-166
2010 – 2019
- 2019
- [c6]Jing Li, Zhao Chen, Mingliang Tan, Douwe van Willigen, Chao Chen, Zu-yao Chang, Emile Noothout, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes. VLSI Circuits 2019: 220- - 2018
- [j4]Eunchul Kang, Qing Ding, Maysam Shabanimotlagh, Pieter Kruizinga, Zu-yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging. IEEE J. Solid State Circuits 53(7): 2065-2075 (2018) - [j3]Mingliang Tan, Chao Chen, Zhao Chen, Jovana Janjic, Verya Daeichin, Zu-yao Chang, Emile Noothout, Gijs van Soest, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging. IEEE J. Solid State Circuits 53(8): 2284-2297 (2018) - [j2]Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-Yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes. IEEE J. Solid State Circuits 53(11): 3050-3064 (2018) - [c5]Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-yao Chang, Mingliang Tan, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes. ISSCC 2018: 186-188 - 2017
- [j1]Chao Chen, Zhao Chen, Deep Bera, Shreyas B. Raghunathan, Maysam Shabanimotlagh, Emile Noothout, Zu-yao Chang, Jacco Ponte, Christian Prins, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography. IEEE J. Solid State Circuits 52(4): 994-1006 (2017) - [c4]Mingliang Tan, Chao Chen, Zhao Chen, Jovana Janjic, Verya Daeichin, Zu-yao Chang, Emile Noothout, Gijs van Soest, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound. CICC 2017: 1-4 - [c3]Eunchul Kang, Qing Ding, Maysam Shabanimotlagh, Pieter Kruizinga, Zu-yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes. ESSCIRC 2017: 211-214 - 2016
- [c2]Chao Chen, Zhao Chen, Deep Bera, Shreyas B. Raghunathan, Maysam Shabanimotlagh, Emile Noothout, Zu-yao Chang, Jacco Ponte, Christian Prins, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A front-end ASIC with receive sub-array beamforming integrated with a 32 × 32 PZT matrix transducer for 3-D transesophageal echocardiography. VLSI Circuits 2016: 1-2 - 2015
- [c1]Michiel A. P. Pertijs, Chao Chen, Shreyas B. Raghunathan, Zili Yu, Maysam Shabanimotlagh, Zhao Chen, Zu-yao Chang, Emile Noothout, Sandra Blaak, Jacco Ponte, Christian Prins, Hans G. Bosch, Martin D. Verweij, Nico de Jong:
Low-power receive electronics for a miniature real-time 3D ultrasound probe. IWASI 2015: 235-238
Coauthor Index
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