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K. F. Chuang

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2016
[j1]
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Ming-Yi Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C. T. Wu, S. C. Hu:
Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectron. Reliab. 67: 120-128 (2016)

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