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Shunji Kurooka

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2010 – 2019

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2019
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Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima:
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. 3DIC 2019: 1-4
2015
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Kosuke Yamashita, Shunji Kurooka, Koji Shirakawa, Yoshinori Hotta, Hirofumi Abe:
Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. 3DIC 2015: TS8.1.1-TS8.1.5

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