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ORCIDPushparajah Rajaguru
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Journal Articles
- 2024
[j7]Pushparajah Rajaguru
, Tim Tilford, Chris Bailey, Stoyan Stoyanov:
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. IEEE Access 12: 25215-25227 (2024)- 2019
- [j6]Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu:
Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. IEEE Access 7: 54658-54669 (2019) - 2018
- [j5]Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea:
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectron. Reliab. 83: 146-156 (2018) - 2017
- [j4]Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68: 77-85 (2017) - [j3]Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey:
Evaluation of SiC Schottky Diodes Using Pressure Contacts. IEEE Trans. Ind. Electron. 64(10): 8213-8223 (2017) - 2015
- [j2]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron. Reliab. 55(6): 919-930 (2015) - [j1]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectron. Reliab. 55(11): 2371-2381 (2015)
Coauthor Index
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last updated on 2024-10-07 22:14 CEST by the dblp team
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