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Hsin-En Cheng

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Journal Articles

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2015
[j2]
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  - journals/qre/ChengCM15
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Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao:
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. Qual. Reliab. Eng. Int. 31(4): 543-566 (2015)
2014
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Hsin-En Cheng, Rong-Sheng Chen:
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method. Microelectron. Reliab. 54(12): 2881-2897 (2014)

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