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H. B. Qin

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2015
[j2]
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H. B. Qin, X. P. Zhang, M. B. Zhou, X. P. Li, Yiu-Wing Mai:
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectron. Reliab. 55(8): 1214-1225 (2015)
2014
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H. B. Qin, Wang-Yun Li, M. B. Zhou, X. P. Zhang:
Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectron. Reliab. 54(12): 2911-2921 (2014)

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