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Steven Shih

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2014
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Ming-Yi Tsai, P. S. Huang, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, J. P. Lin:
An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. Microelectron. Reliab. 54(12): 2898-2904 (2014)

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