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2010 – 2019
- 2019
[c10]Yohei Sobu
, Takasi Simoyama, Shinsuke Tanaka, Yu Tanaka, Ken Morito:
70 Gbaud Operation of All-Silicon Mach-Zehnder Modulator based on Forward-Biased PIN Diodes and Passive Equalizer. OECC/PSC 2019: 1-3- 2018
- [j1]Hideki Ono, Takasi Simoyama, Shigekazu Okumura, Masahiko Imai, Hiroki Yaegashi, Hironori Sasaki:
Waveguide Butt-Joint Germanium Photodetector with Lateral PIN Structure for 1600nm Wavelengths Receiving. IEICE Trans. Electron. 101-C(6): 409-415 (2018) - [c9]Tsuyoshi Aoki, Shigeaki Sekiguchi, Takasi Simoyama, Shinsuke Tanaka, Motoyuki Nishizawa, Nobuaki Hatori, Yohei Sobu, Akio Sugama, Tomoyuki Akiyama, Akinori Hayakawa, Hidenobu Muranaka, Toshihiko Mori, Y. Chen, Seok-Hwan Jeong, Yu Tanaka, Ken Morito:
On-Package High-Density Silicon Photonics Optical Transceiver. ECOC 2018: 1-3 - [c8]Tomoyuki Akiyama, Tsuyoshi Aoki, Takasi Simoyama, Akio Sugama, Shigeaki Sekiguchi, Yohei Sobu, Shinsuke Tanaka, Yu Tanaka, Seok-Hwan Jeong, Motoyuki Nishizawa, Nobuaki Hatori, Akinori Hayakawa, Toshihiko Mori:
Error-Free Loopback of a Compact 25 Gb/s × 4 ch WDM Transceiver Assembly Incorporating Silicon (De)Multiplexers with Automated Phase-Error Correction. OFC 2018: 1-3 - 2017
- [c7]Tsuyoshi Aoki, Shigeaki Sekiguchi, Takasi Simoyama, Shinsuke Tanaka, Motoyuki Nishizawa, Nobuaki Hatori, Yohei Sobu, Akio Sugama, Tomoyuki Akiyama, Akinori Hayakawa, Hidenobu Muranaka, Toshihiko Mori, Yanfei Chen, Seok-Hwan Jeong, Yu Tanaka, Ken Morito:
Low Crosstalk Simultaneous 16-channel × 25 Gb/s Operation of High Density Silicon Photonics Optical Transceiver. ECOC 2017: 1-3 - [c6]Shinsuke Tanaka, Takasi Simoyama, Tsuyoshi Aoki, Toshihiko Mori, Shigeaki Sekiguchi, Seok-Hwan Jeong, Tatsuya Usuki, Yu Tanaka, Ken Morito:
Ultra-Low-Power (1.59 mW/Gbps), 56-Gbps PAM4 Operation of Si Photonic Transmitter Integrating Segmented PIN Mach-Zehnder Modulator and 28-nm CMOS Driver. ECOC 2017: 1-3 - [c5]Tsuyoshi Aoki, Tomoyuki Akiyama, Akio Sugama, Akinori Hayakawa, Hidenobu Muranaka, Takasi Simoyama, Shinsuke Tanaka, Motoyuki Nishizawa, Nobuaki Hatori, Yohei Sobu, Yanfei Chen, Toshihiko Mori, Shigeaki Sekiguchi, Seok-Hwan Jeong, Yu Tanaka, Ken Morito:
Low crosstalk simultaneous 12 ch × 25 Gb/s operation of high-density silicon photonics multichannel receiver. OFC 2017: 1-3 - 2016
- [c4]Seok-Hwan Jeong, Yohei Sobu, Shinsuke Tanaka, Takasi Simoyama, Yu Tanaka, Ken Morito:
WDM interconnect targeted Si-wire optical demultiplexers for large manufacturing tolerance, low voltage tunability and polarization diversified operability. OFC 2016: 1-3 - 2015
- [c3]Yanfei Chen, Masaya Kibune, Asako Toda, Akinori Hayakawa, Tomoyuki Akiyama, Shigeaki Sekiguchi, Hiroji Ebe, Nobuhiro Imaizumi, Tomoyuki Akahoshi, Suguru Akiyama, Shinsuke Tanaka, Takasi Simoyama, Ken Morito, Takuji Yamamoto, Toshihiko Mori, Yoichi Koyanagi, Hirotaka Tamura:
22.2 A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI. ISSCC 2015: 1-3 - [c2]Akinori Hayakawa, Masaya Kibune, Asako Toda, Shinsuke Tanaka, Takasi Simoyama, Yanfei Chen, Tomoyuki Akiyama, Shigekazu Okumura, Takeshi Baba, Tomoyuki Akahoshi, Seiji Ueno, Kazunori Maruyama, Masahiko Imai, Jian Hong Jiang, Pradip Thachile, Tamer Riad, Shigeaki Sekiguchi, Suguru Akiyama, Yu Tanaka, Ken Morito, Daisuke Mizutani, Toshihiko Mori, Takuji Yamamoto, Hiroji Ebe:
A 25 Gbps silicon photonic transmitter and receiver with a bridge structure for CPU interconnects. OFC 2015: 1-3 - 2014
- [c1]Seok-Hwan Jeong, Daisuke Shimura, Takasi Simoyama, Tsuyoshi Horikawa, Yu Tanaka, Ken Morito:
Delayed interferometer based Si-wire WDM demultiplexers fabricated by phase controllable and productive 300-mm wafer-scale ArF-immersion lithography technology. OFC 2014: 1-3
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