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J. Bielen

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2003
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N. Duan, J. Scheer, J. Bielen, M. van Kleef:
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectron. Reliab. 43(8): 1317-1327 (2003)

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