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ORCIDHai Jiang 0005
Person information
- affiliation: Samsung Electronics, Yongin-City, Korea
Other persons with the same name
- Hai Jiang — disambiguation page
- Hai Jiang 0001
![[0000-0003-1042-4897]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-1042-4897")
— University of Alberta, Department of Electrical and Computer Engineering, Edmonton, AB, Canada (and 1 more) - Hai Jiang 0002 — Tsinghua University, Department of Industrial Engineering, Beijing, China
- Hai Jiang 0003 — Arkansas State University, Jonesboro, AR, USA
- Hai Jiang 0004 — Chinese Academy of Sciences, Institute of Computing Technology, Beijing, China
- Hai Jiang 0006 (aka: Jiang Hai 0006) — Sichuan University, School of Aeronautics and Astronautics, Megvii Technology, Chengdu, China
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2020 – today
- 2021
[c9]Hai Jiang, Jinju Kim, Kihyun Choi, Hyewon Shim, Hyunchul Sagong, Junekyun Park, Hwasung Rhee, Euncheol Lee:
Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction. IRPS 2021: 1-6- 2020
- [c8]Tae-Young Jeong, Miji Lee, Yunkyung Jo, Jinwoo Kim, Min Kim, Myungsoo Yeo, Jinseok Kim, Hyunjun Choi, Joosung Kim, Yoojin Jo, Yongsung Ji, Taiki Uemura, Hai Jiang, Dongkyun Kwon, HwaSung Rhee, Sangwoo Pae, Brandon Lee:
Reliability on EUV Interconnect Technology for 7nm and beyond. IRPS 2020: 1-4 - [c7]Yongsung Ji, Hyunjae Goo, Jungman Lim, Tae-Young Jeong, Taiki Uemura, Gun Rae Kim, Boil Seo, Seungbae Lee, Goeun Park, Jeongmin Jo, Sang-Il Han, Kilho Lee, Junghyuk Lee, Sohee Hwang, Daesop Lee, Suksoo Pyo, Hyun Taek Jung, Shinhee Han, Seungmo Noh, Kiseok Suh, Sungyoung Yoon, Hyeonwoo Nam, Hyewon Hwang, Hai Jiang, J. W. Kim, D. Kwon, Yoonjong Song, K. H. Koh, Hwasung Rhee, Sangwoo Pae, E. Lee:
Reliability of Industrial grade Embedded-STT-MRAM. IRPS 2020: 1-3 - [c6]Hai Jiang, Hyun-Chul Sagong, Jinju Kim, Hyewon Shim, Yoohwan Kim, Junekyun Park, Taiki Uemura, Yongsung Ji, Taeyoung Jeong, Dongkyun Kwon, Hwasung Rhee, Sangwoo Pae, Brandon Lee:
Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology. IRPS 2020: 1-5 - [c5]Heung-Kook Ko, Sena Park, Jihyun Ryu, Sung Ryul Kim, Giwon Lee, Dongjoon Lee, Sangwoo Pae, Euncheol Lee, Yongsun Ji, Hai Jiang, Taeyoung Jeong, Taiki Uemura, Dongkyun Kwon, Hyungrok Do, Hyungu Kahng, Yoon-Sang Cho, Jiyoon Lee, Seoung Bum Kim:
Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology. IRPS 2020: 1-5 - [c4]Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida:
Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM. IRPS 2020: 1-4 - [c3]Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Youngin Park, Kiil Hong, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida:
Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET. IRPS 2020: 1-5
2010 – 2019
- 2019
- [c2]Hai Jiang, Hyun-Chul Sagong, Jinju Kim, Junekyun Park, Sangchul Shin, Sangwoo Pae:
Localized Layout Effect Related Reliability Approach in 8nm FinFETs Technology: From Transistor to Circuit. IRPS 2019: 1-5 - [c1]Hyewon Shim, Jeongmin Jo, Yoohwan Kim, Bongyong Jeong, Minji Shon, Hai Jiang, Sangwoo Pae:
Aging-Aware Design Verification Methods Under Real Product Operating Conditions. IRPS 2019: 1-4
Coauthor Index
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