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Daniel P. Seemuth

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Conference and Workshop Papers

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2017
[c3]
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Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow:
Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. ASP-DAC 2017: 372-377
2015
[c2]
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Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow:
Automatic die placement and flexible I/O assignment in 2.5D IC design. ISQED 2015: 524-527
2013
[c1]
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Daniel P. Seemuth, Katherine Morrow:
Automated multi-device placement, I/O voltage supply assignment, and pin assignment in circuit board design. FPT 2013: 262-269

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