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ORCIDJohn H. L. Pang
Person information
- affiliation: Nanyang Technological University, Singapore
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Journal Articles
- 2015
[j7]F. X. Che, John H. L. Pang
:
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectron. Reliab. 55(12): 2769-2776 (2015)- 2009
- [j6]F. X. Che, John H. L. Pang:
Vibration reliability test and finite element analysis for flip chip solder joints. Microelectron. Reliab. 49(7): 754-760 (2009) - 2008
- [j5]Yaofeng Sun, John H. L. Pang:
Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectron. Reliab. 48(2): 310-318 (2008) - [j4]C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun:
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48(4): 611-621 (2008) - 2006
- [j3]Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong:
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron. Reliab. 46(2-4): 558-573 (2006) - [j2]Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low:
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46(7): 1160-1171 (2006) - 2004
- [j1]X. Q. Shi, John H. L. Pang, X. R. Zhang:
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectron. Reliab. 44(5): 841-852 (2004)
Conference and Workshop Papers
Coauthor Index
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