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ORCIDRizalafande Che Ismail
Person information
- affiliation: Universiti Malaysia Perlis, School of Microelectronic Engineering, Malaysia
- affiliation: University of Newcastle upon Tyne, School of Electrical, Electronic and Computer Engineering, UK
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Journal Articles
- 2016
[j1]J. Nicholas Coleman, Rizalafande Che Ismail:
LNS with Co-Transformation Competes with Floating-Point. IEEE Trans. Computers 65(1): 136-146 (2016)
Conference and Workshop Papers
- 2023
- [c8]Muhammad Sufyan Safwan Mohamad Basir
, Nur-Adibah Raihan Affendy, Mohamad Azizan Mohamad Said, Rizalafande Che Ismail, Khairul Huda Yusof:
Short-Time Fourier Transform with Optimum Window Type and Length: An Application for Sag, Swell and Transient. SCDS 2023: 147-160 - 2021
- [c7]Ahmed Jamah Ahmed Alnagrat, Rizalafande Che Ismail, Syed Zulkarnain Syed Idrus:
Design Safety Training Using Extended Reality Tracking Tools in Semiconductor Fabrication Laboratory Furnace. RoViSP 2021: 1041-1046 - 2020
- [c6]Goh Yie Yen, Siti Zarina Md. Naziri, Rizalafande Che Ismail, Mohd Nazrin Md. Isa, Razaidi Hussin:
Design of Multiplicative Inverse Value Generator using Logarithm Method for AES Algorithm. ICM 2020: 1-5 - 2013
- [c5]Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Rizalafande Che Ismail, Nurul Izza Mohd Nor, Nor Shakirina Nadzri, Hussin Kamarudin:
High Power LED Thermal and Stress Simulation on Copper Slug. UKSim 2013: 294-298 - [c4]Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Rizalafande Che Ismail, Nazuhusna Khalid, Mohd Fikri Che Husin, Hussin Kamarudin:
Stress and Temperature Simulation Using Copper-Diamond Composite Slug. UKSim 2013: 299-303 - [c3]Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin:
Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder. UKSim 2013: 317-320 - [c2]Zaliman Sauli, Vithyacharan Retnasamy, Ong Tee Say, Steven Taniselass, Rizalafande Che Ismail, Aaron Koay Terr Yeow, Hussin Kamarudin:
Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball. UKSim 2013: 321-324 - 2011
- [c1]Rizalafande Che Ismail, J. Nicholas Coleman:
ROM-less LNS. IEEE Symposium on Computer Arithmetic 2011: 43-51
Coauthor Index
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