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Journal Articles
- 2013
[j7]Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou
, J. T. Moon:
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53(7): 1002-1008 (2013)- 2012
- [j6]Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon:
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. Microelectron. Reliab. 52(11): 2744-2748 (2012) - 2011
- [j5]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic:
Influence of gold pick up on the hardness of copper free air ball. Microelectron. Reliab. 51(1): 30-37 (2011) - [j4]Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon:
Silver pick up during tail formation in thermosonic wire bonding process. Microelectron. Reliab. 51(1): 38-42 (2011) - [j3]A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. Microelectron. Reliab. 51(1): 43-52 (2011) - [j2]Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51(1): 67-74 (2011) - 2009
- [j1]M. Mayer, J. T. Moon, John Persic:
Measuring stress next to Au ball bond during high temperature aging. Microelectron. Reliab. 49(7): 771-781 (2009)
Coauthor Index
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