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B. Njoman

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2000 – 2009

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2005
[j2]
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  - journals/mr/YaoNCL05
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Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin:
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45(7-8): 1222-1229 (2005)
2004
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T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44(4): 603-609 (2004)

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